Senior Engineer - High-Voltage Chip Package & Board Co-Design (f/m/div)

• Drive the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools and processes
• Collaborate between R&D, EDA vendors, and IT, streamlining tool integration and addressing software and methodology challenges
• Keep a close watch on EDA and software trends to maintain our leading edge in tools and innovation
• Deliver targeted training and support for new methodologies and tools, fostering a culture of learning and efficiency
• Have strong relationships with stakeholders, effectively translating and communicating the benefits of new tool features and methodologies
• Coordinate and align software projects with engineering principles, focusing on tool automation and enhancements
• Guide the team in adopting software best practices, from code reviews to build and test operations

• A university degree in Electrical-, Microelectronic Engineering or Computer Science
• A strong background in EDA/PLM methodology with proven experience in design flow development and CAD project execution
• Experience with Cadence, Synopsys or Siemens EDA tools
• Knowledge of IC driven package technologies
• Software programming and scripting skills including modern software engineering practices like version control, continuous integration and automated testing frameworks
• Experience in technical leadership and project management would be considered an asset
• Excellent verbal and written communication skills in English

Driving decarbonization and digitalization. Together.

Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.

The central R&D organization „Design Enabling and Services“ (DES) provides the design environments (design-systems) to the different product development teams at Infineon. With leading edge design methods, complex building blocks and a wide range of product development services DES enables Infineon's advanced IC development. This means the complete value creation chain from abstract system models down to the fully verified product layout which ensures high quality manufacturing readiness.

At Infineon in Villach you shape the technologies of tomorrow and work in an international environment with more than 4700 colleagues from over 70 nations. Your personal contribution will be valued and appreciated as the cornerstones of our success. And all that in beautiful surroundings which guarantee a high quality of life.

The City of Villach is located in the center of Carinthia, Austria’s southernmost province, in close proximity to the Italian and Slovenian border. Living in Austria has many social, health-care-related and economic perks. The country’s social and health care system is among the best in the world and for decades numerous international surveys have singled out Austria as a particularly safe and wealthy country with a high quality of life. Villach itself benefits from its status as a “small town”, offering everyday living at affordable prices in an outstanding setting.

Find out what you like most about Villach and join us:
https://www.welcome2villach.at/

We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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